Dr. Tresky AG
Fine placing
Flip chip bonding
Microassembly
Micropackaging
Eutectic die bonding
Semiconductors
Founded in 1980
Thalwil, Zurich
Dr. Tresky AG information
Tresky offers manual and semi-manual Die Bonding solutions for small and medium sized electronics assembly facilities, laboratories and R&D. For now 40 years, Tresky has been perfecting the art of creating handling and pick & place systems.We invite you to discover our range of Die Bonding solutions, tools and services.
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