❖ 𝐀𝐏𝐓𝐄 is a dynamic organisation that bridges the gap between academia and industry in the field of electronics. ❖ At 𝐀𝐏𝐓𝐄 , we believe in the power of partnerships and networking. As the representative of the 𝑰𝑴𝑨𝑷𝑺 (𝑰𝒏𝒕𝒆𝒓𝒏𝒂𝒕𝒊𝒐𝒏𝒂𝒍 𝑴𝒊𝒄𝒓𝒐𝒆𝒍𝒆𝒄𝒕𝒓𝒐𝒏𝒊𝒄𝒔 𝑨𝒔𝒔𝒆𝒎𝒃𝒍𝒚 𝒂𝒏𝒅 𝑷𝒂𝒄𝒌𝒂𝒈𝒊𝒏𝒈 𝑺𝒐𝒄𝒊𝒆𝒕𝒚), 🇹🇩 𝓡𝓸𝓶𝓪𝓷𝓲𝓪𝓷 𝓒𝓱𝓪𝓹𝓽𝓮𝓻, we actively promote technical advancements and facilitate knowledge sharing between industry representatives and academics. ❖ 𝑺𝑰𝑰𝑻𝑴𝑬 (𝑰𝒏𝒕𝒆𝒓𝒏𝒂𝒕𝒊𝒐𝒏𝒂𝒍 𝑺𝒚𝒎𝒑𝒐𝒔𝒊𝒖𝒎 𝒇𝒐𝒓 𝑫𝒆𝒔𝒊𝒈𝒏 𝒂𝒏𝒅 𝑻𝒆𝒄𝒉𝒏𝒐𝒍𝒐𝒈𝒚 𝒐𝒇 𝐄𝐥𝐞𝐜𝐭𝐫𝐨𝐧𝐢𝐜 𝐏𝐚𝐜𝐤𝐚𝐠𝐢𝐧𝐠) is 𝐀𝐏𝐓𝐄's flagship event, bringing together researchers, professionals, and scientists from Europe. ❖ 𝑻𝑰𝑬 (𝑰𝒏𝒕𝒆𝒓𝒄𝒐𝒏𝒏𝒆𝒄𝒕𝒊𝒐𝒏 𝑻𝒆𝒄𝒉𝒏𝒊𝒒𝒖𝒆𝒔 𝒊𝒏 𝑬𝒍𝒆𝒄𝒕𝒓𝒐𝒏𝒊𝒄𝒔), including 𝑻𝑰𝑬 𝑴, 𝑻𝑰𝑬 𝑷𝒍𝒖𝒔 and 𝑻𝑰𝑬 𝑴 𝑷𝒍𝒖𝒔, is a prestigious student competition organised by 𝐀𝐏𝐓𝐄, highlighting expertise in electronic module and PCB design. ❖ We are proud to collaborate with 𝑰𝑬𝑬𝑬 (𝑰𝒏𝒔𝒕𝒊𝒕𝒖𝒕𝒆 𝒐𝒇 𝑬𝒍𝒆𝒄𝒕𝒓𝒊𝒄𝒂𝒍 𝒂𝒏𝒅 𝑬𝒍𝒆𝒄𝒕𝒓𝒐𝒏𝒊𝒄𝒔 𝑬𝒏𝒈𝒊𝒏𝒆𝒆𝒓𝒔) as our valued partner. Our partnership with 𝑰𝑬𝑬𝑬 allows us to stay at the forefront of industry advancements, access global resources, and engage with a network of professionals. ❖ 𝐀𝐏𝐓𝐄 collaborates with 𝑨𝑺𝑨 (𝑨𝒖𝒕𝒐𝒎𝒐𝒕𝒊𝒗𝒆 𝑺𝒌𝒊𝒍𝒍𝒔 𝑨𝒍𝒍𝒊𝒂𝒏𝒄𝒆) to drive skills development and knowledge transfer in the automotive electronics sector. By bridging the gap between academia and the automotive industry, 𝐀𝐏𝐓𝐄 and 𝑨𝑺𝑨 work together to drive innovation and enhance expertise in this rapidly evolving field. ❖ With a commitment to excellence, innovation, and professional collaboration, 𝐀𝐏𝐓𝐄 shapes the future of 𝐄𝐥𝐞𝐜𝐭𝐫𝐨𝐧𝐢𝐜 𝐏𝐚𝐜𝐤𝐚𝐠𝐢𝐧𝐠, empowering the next generation of engineers.