Full service electronics manufacturing company. Capabilities include design for manufacturing (DFM), turnkey manufacturing, box building manufacturing, consignment manufacturing, rapid prototype assembly, functional testing, trouble shooting, project management, printed circuit consultancy, design consultancy and production, materials management, process control, product design support, volume production, product fulfillment, ball grid array (BGA), chip scale packaging (CSP), after-market service and warranty support. Markets served include military, medical, lighting, consumer electronics, communication and networking and etc.