Yuan-shin Materials Technology Co., Ltd. (YSMTC) was established in 2004 with the full support of Taiwan Styrene Monomer Corporation (TSMC), which is listed on the Taiwan Stock Exchange. Using TSMC's R&D laboratory as the basis for process design and scale-up capabilities, and in collaboration with Taiwan's national research institutes, YSMTC has developed commercial production technologies for o...Yuan-shin Materials Technology Co., Ltd. (YSMTC) was established in 2004 with the full support of Taiwan Styrene Monomer Corporation (TSMC), which is listed on the Taiwan Stock Exchange. Using TSMC's R&D laboratory as the basis for process design and scale-up capabilities, and in collaboration with Taiwan's national research institutes, YSMTC has developed commercial production technologies for organofluorine compounds over the past few decades. YSMTC has been granted 24 patents, covering the synthesis of Parylene AF4 and its precursors, in the United States, Japan, China and Taiwan. The purity of YSMTC Parylene AF4 is the highest on the market, and the quality has been certified by world-renowned companies.In addition to the general characteristics of other Parylene variants' coating, such as pin-hole free conformal coating, waterproof, salt spray resistance, etc., the characteristics of chemical solvent resistance, acid and alkali corrosion resistance, UV resistance and high temperature resistance highlight the particularity of Parylene AF4 coating.1. Product: Parylene AF4, CAS # 3345-29-7 1,1,2,2,9,9,10,10-Octafluoro[2.2]Paracyclophane, C16H8F8 GR grade: 99.2%min, EP Grade: 99.7% min2. YSMTC Parylene AF4 Properties: Resistance to Oxidation Low CTE RoHS Compliance Crevice Penetration Ability Sterilization Ability Radiation Resistance Thermal Humidity Aging Resistance Whisker Growth Prevention/Mitigation Dry Lubricity Higher Temperature Integrity Barrier Properties and Chemical Inertness Electrical Resistance Fungus Resistance Corrosion Control3. YSMTC Parylene AF4 Applications: Protection or Barrier for MEMS device structural Material MEMS device Encapsulation Wafer Level Package /Redistribution Layer Lithium Ion Battery(LIB)Separator Film 3D IC TSV Liner, IGBT /SiC High Power Electronic Encapsulation Energy Harvesting Generator Microfluidic Electro Wetting Device (EWOD)